
XST 6800
A high-resolution offline system for BGA, solder joint, and electronic component inspection, with programmable image capture, measurement, and image analysis.
- 100 kV X-ray source, 5 μm focal spot, and automatic tube sleep protection
- 560 × 530 mm sample size and 5 kg maximum sample weight
- 200× geometric magnification, 2000× system magnification, and receiver support for 60° angled inspection




